MESAP’S INTERNATIONALIZATION ACTIVITIES
5E Project: Discover the Mesap MEMBERS who have joined the Digital Showcase
The Digital Showcase of the 5E project is a European platform dedicated to electronic products in nanoelectronics, electronic smart systems and flexible, organic & printed electronics.
Below the 9 MESAP members who have already joined the initiative with their products: Adgenera Srl, Brain Technologies, MECT SRL, Novasis Innovazione Srl, ORCHESTRA Srl, PHI DRIVE SRL, Sequoia IT, TESEO SPA, Wiicom Srl.
For more details see the dedicated News.
Final steps for the IoT4Industry project that celebrates its 40 funded projects including 5 MESAP members. The 40 projects will participate in a contest to reward their innovative character; a challenge that will focus on the realization of a video through which to tell how the IoT solution has been integrated into the production process! A jury will identify the 3 finalists who will be awarded at the MTC Digitalising Manufacturing Conference 2020, 5-6 October 2020.
The conference will be virtual. To learn more about the program visit the website.
Innovation Fund – First call for projects with low CO2 emissions
On July 3, 2020 the European Commission – DG CLIMA published the first call for the submission of large-scale projects in low-carbon technologies and processes, under the Innovation Fund. The call has a budget of 1 billion Euro. The projects can receive support of up to 60% of the capital and operational costs related to innovation, with the possibility to provide up to 40% in the preparation and study phase. The deadline for the submission of projects for Phase I is October 29th.
Visit the portal dedicated to the Call for proposals.
SmartEES2: European Open Call for flexible & wearable electronics solutions
On 23rd September 2020 closes the second call of the European SmartEES2 program to support innovative companies that have a project focused on flexible and wearable electronic technologies (FWE) that would like to test and experiment it. Smartees provides a funding scheme that provides up to 100,000 euros for each Application Experiment.
For more details visit the website.
The 23rd IEEE International Conference on Intelligent Transportation Systems
20 – 23 September 2020
The conference is the annual flagship event organized by the Intelligent Transportation Systems Society (ITSS) and will be held on September 20-23, 2020 in virtual mode.
European Research & Innovation Days 2020
22 – 26 September 2020
The European Research and Innovation Days are the European Commission’s annual event that brings together policy makers, researchers, entrepreneurs and citizens to discuss and shape the future of research and innovation in Europe and beyond.
The 2020 event will be characterized by three days of intense policy co-designing, reflection panels and matchmaking opportunities. In a crucial year, in view of the launch of Horizon Europe, the next research and innovation programme starting in 2021, this event is a unique opportunity to discuss how research and innovation will benefit Europe’s future.
Registrations are now open for the EPoSS Annual Forum 2020- Smart Systems to #BeActive
29 – 30 September 2020
This year’s Forum will have a special focus on intelligent systems for sports and healthcare applications and will address issues related to sustainable and healthy environment and key integration technologies for flexible and wearable smart systems. The event is organized and supported in collaboration with EPSI – European Platform for Sport Innovation – as part of the European Sports Week.
Please note that participation is free of charge.
To register for the event and for further information visit the dedicated website.
SSI Conference & Exhibition 2021: Call For Papers!
27 – 29 April 2021
The Smart Systems Integration Conference & Exhibition starts again after a year break with a new concept in Grenoble, France, 27-29 April 2021. As co-organizer of the event, the EPoSS Association invites to present the recent developments in the field of Smart Systems along the entire value chain, starting from MEMS/NEMS, photonics, micromechanics, microfuidics, printed functionality up to complete systems and different application scenarios.